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This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
Author | VDE |
---|---|
Editor | VDE |
Document type | Standard |
Format | Paper |
ICS | 19.040 : Environmental testing
31.190 : Electronic component assemblies |
Number of pages | 59 |
Replace | DIN EN 60068-2-54 (2007-01) |
Cross references | EN 60068-2-69 (2017-06), IDT |
Modified by | DIN EN 60068-2-69 Berichtigung 1 (2018-05)
|
Weight(kg.) | 0.2003 |
Year | 2018 |
Document history | DIN EN 60068-2-69 (2018-01) |
Country | Germany |
Keyword | DIN EN 60068;DIN EN 60068-2;EN 60068;EN 60068-2;EN 60068-2-69;60068 |